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Fr4 High Tg 1.6mm 12layer heavey gold
【Brief】:

Model Number: PCB

Type: High TG PCB

Place of Origin: Guangdong, China

Brand Name: LDES

Number of Layers: 1-50 Layers

Base Material: FR-4

Copper Thickness: 1/2 oz min;12 oz max, 1/2 oz min; 12 oz max

Board Thickness: 0.2mm-6.00 mm(8mil-126mil), 0.2mm-6mm(8mil-126mil)

Min. Hole Size: 0.1mm(4mil), 0.1mm(4mil)

Min. Line Width: 0.075mm(3mil)

Min. Line Spacing: 0.075mm(3mil)

Surface Finishing: ENIG

Board Size: multilayer pcb

Solder Mask: Green. Red. Blue. White. Black.Yellow

Testing Service: 100% E-testing

Silkscreen color: Black, white, yellow, red, blue

Service: One-stop


【Series】:FR4 PCB

1.Details

Type: Fr4 High Tg 1.6mm 12layer heavey gold

Place of Origin: Guangdong, China

Brand Name: LDES

Base Material: FR4/ High TG FR-4/Rogers/Aluminum

Copper Thickness: 1 - 4oz

Board Thickness: 0.2 - 4mm

Min. Hole Size: 0.15mm

Min. Line Width: 0.1mm

Min. Line Spacing: 0.1mm

Surface treatment: HASL, OSP, ENIG, Immersion Tin, Lead-free HASL

minimum solder resist opening: 1.5mil

minimum solder resist bridge: 3mil

maximum aspect Ratio: 10:01

impedance control accuracy: ±8%

maximum board size: 630*1100mm

maximum layer: 12

Certificate: ISO14001, ISO9001, TS16949, ROHS,UL


2.Capability


HDI PCB Manufacturing Capability
minimum linewidth/linespacing

2MIL/2MIL(0.05MM)

minimum hole diameter

6MIL(0.15MM)

minimum solder resist opening (single-side)

1.2MIL(0.03MM)

minimum solder resist bridge

2.2MIL(0.055MM)

maximum aspect Ratio (thickness/hole diameter)

8:1

impedance control accuracy

+/-8%

finished thickness

0.2-3.2MM

maximum board size

620MM*544MM

maximum finished copper thickness

2OZ(70UM)

minimum board thickness

3MIL(0.076MM)

maximum layer

12 Layers

Surface treatment

Immersion Gold、OSP、selective immersion gold、

carbon print

min/max laser hole size

3MIL  /  9.8MIL

laser hole size tolerance

10


3. HDI Related PCB Board






4. Workshop



5. Certificates

 

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