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High density multi-layer PCB board
【Brief】:Material: High TG, high thermal conductivity material

Medium thickness: ≥0.09mm

Inner copper thickness: ≤18 OZ

Highest level: 24 Layers

Features: thick copper step technology

A variety of surface treatments

Hole filling plating and stack structure

Sheet and surface smoothness requirements
【Series】:FR4 PCB

1.Details

Type: TG170 Heavy cooper heavy gold 8L FR4  PCB 

Place of Origin: Guangdong, China

Brand Name: LDES

Base Material: FR4/ High TG FR-4/Rogers/Aluminum

Copper Thickness: 1 - 4oz

Board Thickness: 0.2 - 4mm

Min. Hole Size: 0.15mm

Min. Line Width: 0.1mm

Min. Line Spacing: 0.1mm

Surface treatment: HASL, OSP, ENIG, Immersion Tin, Lead-free HASL

minimum solder resist opening: 1.5mil

minimum solder resist bridge: 3mil

maximum aspect Ratio: 10:01

impedance control accuracy: ±8%

maximum board size: 630*1100mm

maximum layer: 12

Certificate: ISO14001, ISO9001, TS16949, ROHS,UL


2.Capability





3. FR4 Related PCB Board






4. Workshop



5. Certificates

 

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