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RO4003c PCB
【Brief】:RO4003C High Frequency Circuit Material is glass reinforced hydrocarbon/ceramic laminates(Not PTFE) designed for performance senstive, high volume commercial applications.Double sided and multilayer RO4003C PCB and hybrid RO4003C PCB are available in Landes company at present.Double sided RO4003c PCB with thickness 12mil(0.305mm), 20mil(0.508mm) and 32mil(0.813mm) are the bestsellers.We provide prototype runs, small batches and volume production services.
【Series】:Rogers PCB
RO4350B & RO4003C Data Sheets
Property Typical Value Direction Units Condition Test Method
  RO4003C RO4350B        
Dielectric Constant, εr Process 3.38±0.05 3.48±0.05 Z - 10 GHz/23ºC IPC-TM-650    2.5.5.5      Clampled Stripline
Dielectric Constant, εr Design 3.55 3.66 Z - 8 to 40 GHz Differntial Phase Length Method
Dissipation Factor Tan, δ 0.0027     0.0021 0.0037    0.0031 Z - 10 GHz/23ºC   2.5 GHz/23ºC  IPC-TM-650    2.5.5.5
Thermal Coefficient of  εr  40 50 Z ppm/ºC minus 50ºC to 150ºC IPC-TM-650    2.5.5.5
Volume Resistivity 1.7 x 10¹º 1.2 x 10¹º   MΩ·CM COND A IPC-TM-650    2.5.17.1
Surface Resistivity 4.2 x 10^9 5.7 x 10^9   COND A IPC-TM-650   2.5.17.1
Electrical Strenghth 31.8       (780) 31.2       (780) Z KV/mm    (V/mil) 0.51mm  (0.020") IPC-TM-650    2.5.6.2
Tensile Modulus 19650(2850)   19450(2821) 16767 (2432)  14153 (2053) X              Y Mpa(ksi) RT ASTM D638
Tensile Strength 139(20.2)     100(14.5) 203(29.5)    130(18.9) X              Y Mpa(ksi) RT ASTM D638
Flexural Strength 276         (40) 255         (37)   Mpa(kpsi)   IPC-TM-650      2.4.4
Dimensional Stability <0.3 <0.5 X,Y mm/m    (mils/inch) after etch E2/150ºC IPC-TM-650    2.4.39A
Coefficient of Thermal Expansion 11            14            46 10            12            32 X              Y              Z ppm/ºC minus 55ºC to 288ºC IPC-TM-650     2.4.41
Tg >280 >280   ºC TMA IPC-TM-650     2.4.24
Td 425 390   ºC TGA   ASTM D3850
Thermal Conducvitity 0.71 0.69   W/m/ºk 80ºC ASTM C518
Moisture Absorption 0.06 0.06   % 48 hrs immersion 0.060" sample Temperature 50ºC ASTM D570
Density 1.79 1.86   gm/cm³ 23ºC ASTM D792
Copper Peel Strength 1.05       (6.0) 0.88       (5.0)   N/mm       (pli) after solder float 1 oz. EDC Foil IPC-TM-650      2.4.8
Flammability N/A V-0       UL 94
Lead-Free Process Compatible Yes Yes  
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