- Polyimide Flex PCB
- 【Brief】：This is a type of flexible PCB built on polyimide 76 micron substrate with 90 ohm impedance
controlled on 0.15mm/0.3mm track and gap for the application of Wireless Broadband. It's
standard 0.20 mm thick with yellow solder mask (coverlay) on both sides and immersion
gold are on pads. FR-4 as stiffener is on the head and tail. - 【Series】：Flexible PCB
Parameter and data sheet
| PCB Size: | 116 X 108mm = 1 PCS |
| Number of Layers | 2 layers |
| Board Type | Flexbile PCB |
| Board Thickness | 0.2mm +/-10% |
| Stackup | TOP FR-4 Steffener 0.8mm |
| PI coverlay 0.025mm | |
| Copper top 0.035mm finish | |
| Polyimide substrate 0.076mm | |
| Copper top 0.035mm finish | |
| PI coverlay 0.025mm | |
| Board Material Supplier | Shengyi |
| Tg Value of Board Material | 60ºC |
| PTH Cu thickness | 20 um |
| Inner Iayer Cu thicknes | N/A |
| Surface Cu thickness | 35 um (1oz) |
| Coverlay Colour | Yellow |
| Number of Coverlay | 2 |
| Thickness of Coverlay | 25 um |
| Stiffener | FR-4 0.8mm |
| Type of Silkscreen Ink | N/A |
| Supplier of Silkscreen | N/A |
| Color of Silkscreen | N/A |
| Number of Silkscreen | N/A |
| Minimum via (mm) | 0.3 |
| Minimum Trace (mil) | 5.90 |
| Minimum Gap(mil) | 11.8 |
| Surface Finish | Immersion Gold |
| RoHS Required | Yes |
| Famability | 94-V0 |
| Thermal Shock Test | Pass, -25ºC±125ºC, 1000 cycles. |
| Thermal Stress |
Pass, 300±5ºC,10 seconds, 3 cycles. No delamination, no blistering. |
| Function | 100% Pass electrical test |
| Workmanship | Compliance with IPC-A-600H & IPC-6013C Class 2 |
| Type of artwork to be supplied | email file, Gerber RS-274-X, PCBDOC etc |
| Service area | Worldwide, Globally. |
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