- 12 Layer HDI PCB Board(Blind Buried vias)
- 【Brief】：Base Material: FR4 IT180 TG180
Board Thickness: 2.0mm
Copper Thickness: 2OZ
Min. Hole Size:0.1mm
Min. Line Width: 8 mil
Surface Finishing: ENIG
Solder mask: Blue
Blind Buried vias: L1-L2,L3-L4..... - 【Series】：FR4 PCB
1.Details
Model Number: PCB-0068
Type: HDI PCB
Place of Origin: Guangdong, China
Brand Name: LDES
Base Material: FR4/ High TG FR-4/Rogers/Aluminum
Copper Thickness: 1 - 4oz
Board Thickness: 0.2 - 5mm
Min. Hole Size: 0.15mm
Min. Line Width: 0.1mm
Min. Line Spacing: 0.1mm
Surface treatment: HASL, OSP, ENIG, Immersion Tin, Lead-free HASL
minimum solder resist opening: 1.5mil
minimum solder resist bridge: 3mil
maximum aspect Ratio: 10:01
impedance control accuracy: ±8%
maximum board size: 630*1100mm
maximum layer: 14
Certificate: ISO14001, ISO9001, TS16949, ROHS,UL
2.Capability
2MIL/2MIL(0.05MM)
minimum hole diameter
6MIL(0.15MM)
minimum solder resist opening (single-side)
1.2MIL(0.03MM)
minimum solder resist bridge
2.2MIL(0.055MM)
maximum aspect Ratio (thickness/hole diameter)
8:1
impedance control accuracy
+/-8%
0.2-3.2MM
maximum board size
620MM*544MM
maximum finished copper thickness
2OZ(70UM)
minimum board thickness
3MIL（0.076MM）
maximum layer
12 Layers
Surface treatment
Immersion Gold、OSP、selective immersion gold、
carbon print
min/max laser hole size
3MIL / 9.8MIL
laser hole size tolerance
10
HDI PCB Manufacturing Capability
minimum linewidth/linespacing
finished thickness
3. HDI Related PCB Board
4. Workshop
5. Certificates
