- Fr4 High Tg 1.6mm 12layer heavey gold
- 【Brief】:
Model Number: PCB
Type: High TG PCB
Place of Origin: Guangdong, China
Brand Name: LDES
Number of Layers: 1-50 Layers
Base Material: FR-4
Copper Thickness: 1/2 oz min;12 oz max, 1/2 oz min; 12 oz max
Board Thickness: 0.2mm-6.00 mm(8mil-126mil), 0.2mm-6mm(8mil-126mil)
Min. Hole Size: 0.1mm(4mil), 0.1mm(4mil)
Min. Line Width: 0.075mm(3mil)
Min. Line Spacing: 0.075mm(3mil)
Surface Finishing: ENIG
Board Size: multilayer pcb
Solder Mask: Green. Red. Blue. White. Black.Yellow
Testing Service: 100% E-testing
Silkscreen color: Black, white, yellow, red, blue
Service: One-stop
- 【Series】:FR4 PCB
1.Details
Type: Fr4 High Tg 1.6mm 12layer heavey gold
Place of Origin: Guangdong, China
Brand Name: LDES
Base Material: FR4/ High TG FR-4/Rogers/Aluminum
Copper Thickness: 1 - 4oz
Board Thickness: 0.2 - 4mm
Min. Hole Size: 0.15mm
Min. Line Width: 0.1mm
Min. Line Spacing: 0.1mm
Surface treatment: HASL, OSP, ENIG, Immersion Tin, Lead-free HASL
minimum solder resist opening: 1.5mil
minimum solder resist bridge: 3mil
maximum aspect Ratio: 10:01
impedance control accuracy: ±8%
maximum board size: 630*1100mm
maximum layer: 12
Certificate: ISO14001, ISO9001, TS16949, ROHS,UL
2.Capability
HDI PCB Manufacturing Capability | |
minimum linewidth/linespacing |
2MIL/2MIL(0.05MM) |
minimum hole diameter |
6MIL(0.15MM) |
minimum solder resist opening (single-side) |
1.2MIL(0.03MM) |
minimum solder resist bridge |
2.2MIL(0.055MM) |
maximum aspect Ratio (thickness/hole diameter) |
8:1 |
impedance control accuracy |
+/-8% |
finished thickness |
0.2-3.2MM |
maximum board size |
620MM*544MM |
maximum finished copper thickness |
2OZ(70UM) |
minimum board thickness |
3MIL(0.076MM) |
maximum layer |
12 Layers |
Surface treatment |
Immersion Gold、OSP、selective immersion gold、 carbon print |
min/max laser hole size |
3MIL / 9.8MIL |
laser hole size tolerance |
10 |
3. HDI Related PCB Board
4. Workshop
5. Certificates